As a next-generation test platform, STT-700 features  26-slot architecture, supporting mixed configuration of analog VI test modules and power device test modules — unique capability in the industry.

With a single platform, STT-700 can cover both analog / mixed-signal IC testing and power semiconductor device testing, significantly reducing equipment investment, floor space, and maintenance costs associated with multiple dedicated test systems.

For analog and mixed-signal IC test, STT-700 can be configured with up to:

  • 416 high-precision analog VI channels

  • 256 digital channels (100 MHz, 64 M vector memory)

This configuration is ideal for high-parallel, multi-site testing of general analog ICs and high-pin-count mixed-signal devices, such as PMICs, BMS, AFEs, and interface ICs, delivering both high throughput and excellent test accuracy and consistency.

For power device test, STT-700 supports a wide range of dedicated test modules and test fixtures, enabling efficient test solutions from wafer-level to final package, including but not limited to:

The platform is suitable for IGBTs, SiC MOSFETs, power MOSFETs, and power modules, providing a scalable, high-parallel, and highly consistent test solution to meet the demands of modern high-voltage, high-speed, and high-reliability power semiconductor devices.

👉 Click here to view the configurable resource list