As a next-generation test platform, STT-700X features an industry-leading 13-slot architecture, supporting mixed configuration of analog VI test modules and power device test modules -- a unique capability in the industry.
With a single platform, STT-700X can cover both analog / mixed-signal IC testing and power semiconductor device testing, significantly reducing equipment investment, floor space, and maintenance costs associated with multiple dedicated test systems.

Power Semiconductor Device Testing

For power devices, STT-700 supports a wide range of dedicated test modules and test fixtures, enabling efficient test solutions from wafer-level to final package, including but not limited to:

DC static parameter testing
DVSD thermal resistance measurement
UIL avalance capability testing
RG/CG parameter measurement
Double pulse switching characterization(Ton/Toff/Qg/Trr/Ishort etc.,)
Dynamic Rdson test for GAN

The platform is suitable for IGBTs, SiC MOSFETs, power MOSFETs, and power modules, providing a scalable, high-parallel, and highly consistent test solution to meet the demands of modern high-voltage, high-speed, and high-reliability power semiconductor devices.

Analog / Mixed-Signal Device Testing

For analog and mixed-signal applications, STT-700 can be configured with up to 208 high-precision analog VI channels and 128 digital pins(100Mhz, 64M vector memory).

This configuration is ideal for high-parallel, multi-site testing of general analog ICs such as AC-D, DC-DC, LDO and interface ICs, delivering both high throughput and excellent test accuracy and consistency.

👉 Click here to view the configurable resource list